Silicone-free thermal pad non-silicone material
Silicon-free Thermal Pads are silicone-free volatile materials, it is a kind of soft silicone oil-free thermal gap filling material,also known as oil-free and pollution-free thermal conductive silicone pads.
Non-silicone thermally conductive gasket,with high thermal conductivity, low thermal resistance, high compressibility, controllable hardness, no silicone in the operating environment under pressure and heat The volatilization of small molecules prevents the volatilization of small siloxane molecules from being adsorbed on the PCB board, which indirectly affects the performance of the body.
Silicone-free material is suitable for silicon-sensitive applications, with lower hardness than traditional non-silicon materials, providing higher deformation and more flexibility. The silicon-free thermal pad acts on the gap between the heat source and the radiator/shell. Due to its good softness, it can effectively remove the air from the interface, reduce the thermal resistance of the interface, and improve the thermal conductivity.
Commonly used silicone-free gaskets are BERGQUIST GAP PAD TGP 3004SF
BERGQUIST GAP PAD TGP 3004SF is a high perfromance, silicone free, thermally conductive gap pad ideal for silicone sensitive applications.
BERGQUIST GAP PAD TGP 3004SF is a silicone free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby
offers exceptionally low interfacial resistance to adjacent surfaces.This product has no silicone content and is therefore ideal for silicone sensitive applications.
Thermal Conductivity: 3.0 W/m-K
Silicone-free formulation
Tacky side allows for ease of handling and placement
0.25 mil PET provides easy disassembly, leaving no residue
BERGQUIST SIL PAD TSP PPK1300 also known as POLY-PAD K-10 is also a silicone-free thermally conductive material.
For applications requiring non-silicone conformal coatings.
Non-silicone thermally conductive gasket,with high thermal conductivity, low thermal resistance, high compressibility, controllable hardness, no silicone in the operating environment under pressure and heat The volatilization of small molecules prevents the volatilization of small siloxane molecules from being adsorbed on the PCB board, which indirectly affects the performance of the body.
Silicone-free material is suitable for silicon-sensitive applications, with lower hardness than traditional non-silicon materials, providing higher deformation and more flexibility. The silicon-free thermal pad acts on the gap between the heat source and the radiator/shell. Due to its good softness, it can effectively remove the air from the interface, reduce the thermal resistance of the interface, and improve the thermal conductivity.
Commonly used silicone-free gaskets are BERGQUIST GAP PAD TGP 3004SF
BERGQUIST GAP PAD TGP 3004SF is a high perfromance, silicone free, thermally conductive gap pad ideal for silicone sensitive applications.
BERGQUIST GAP PAD TGP 3004SF is a silicone free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby
offers exceptionally low interfacial resistance to adjacent surfaces.This product has no silicone content and is therefore ideal for silicone sensitive applications.
Thermal Conductivity: 3.0 W/m-K
Silicone-free formulation
Tacky side allows for ease of handling and placement
0.25 mil PET provides easy disassembly, leaving no residue
BERGQUIST SIL PAD TSP PPK1300 also known as POLY-PAD K-10 is also a silicone-free thermally conductive material.
For applications requiring non-silicone conformal coatings.
