Home
Product Catalog
News
Contact Us

Product Catalog 

BERGQUIST GPHC5.0 GAP PAD TGP HC5000

  • BERGQUIST GPHC5.0 GAP PAD TGP HC5000
  • BERGQUIST GPHC5.0 GAP PAD TGP HC5000
  • BERGQUIST GPHC5.0 GAP PAD TGP HC5000
  • BERGQUIST GPHC5.0 GAP PAD TGP HC5000
  • BERGQUIST GPHC5.0 GAP PAD TGP HC5000
Model No.︰GPHC5.0
Brand Name︰BERGQUIST
Country of Origin︰United States
Unit Price︰US $ 1 / pcs
Minimum Order︰10 pcs
Share on:

 Total 20 Related Items 
Prev12345Next

Product Description

BERGQUIST GAP PAD TGP HC5000 is  a soft and compliant gap filling material  with 

a thermal conductivity of 5.0 W/m-K.  The material offers exceptional thermal  performance 

at low pressures due to a  unique filler package and low-modulus resin  formulation. 

The enhanced material is ideal  for applications requiring low stress on  components 

and boards during assembly.  BERGQUIST GPHC5.0 maintains a conformable 

nature that  allows for excellent interfacing and wet-out  characteristics, even to surfaces with 

high  roughness and/or topography. BERGQUIST GAP PAD HC5.0 is  offered with 

natural inherent tack on both  sides of the material, eliminating the need  for thermally-impeding 

adhesive layers.  The top side has minimal tack for ease of  handling. BERGQUIST GAP PAD TGP  HC5000 

is supplied with protective liners on both sides.

 

Payment Terms︰TT
Product Image






Related Products
LOCTITE 315
LOCTITE 315
US $ 1
BERGQUIST BP660P BOND-PLY TBP 400P BOND-PLY 660P
BERGQUIST BP660P BOND-PLY TBP 400P BOND-PLY 660P
US $ 1
BERGQUIST BP800 BOND-PLY TBP 800 BOND-PLY 800
BERGQUIST BP800 BOND-PLY TBP 800 BOND-PLY 800
US $ 1
Laird Tflex 300 Tflex360
Laird Tflex 300 Tflex360
US $ 1.2




Home  |  Product Catalog  |  News  |  Contact Us  |  Sitemap  |  Mobile Version

Powered by DIYTrade.com  Build your FREE website !