BERGQUIST GAP PAD TGP HC5000 is a soft and compliant gap filling material with
a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance
at low pressures due to a unique filler package and low-modulus resin formulation.
The enhanced material is ideal for applications requiring low stress on components
and boards during assembly. BERGQUIST GPHC5.0 maintains a conformable
nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with
high roughness and/or topography. BERGQUIST GAP PAD HC5.0 is offered with
natural inherent tack on both sides of the material, eliminating the need for thermally-impeding
adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC5000
is supplied with protective liners on both sides.
