BERGQUIST GPVOUS,GAP PAD TGP 1000VOUS,GAP PAD VO Ultra Soft
Ultra-Conformable, Thermally Conductive Material for Filling Air Gaps
BERGQUIST GPVOUS Features and Benefits
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Decreased strain
• Puncture-, shear- and tear-resistant
• Electrically isolating
BERGQUIST GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure
on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock
absorbing characteristics. BERGQUIST GAP PAD VO Ultra Soft is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
BERGQUIS GPVOUS Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Areas where heat needs to be transferred to a frame, chassis, or other type of
heat spreader
Configurations Available:
• Sheet form and die-cut parts
