• High performance filler and polymer technology
• Phase change at 45°C
• Highly conductive filler loading to optimize performance
• Superior handling and reworkability
• Superior reliable thermal performance
• Available in both pad and paste formats
Honeywell PCM45F, a highly thermally conductive Phase Change Material (PCM), was designed to minimize thermal resistance at interfaces.
Based on a novel polymer PCM system, Honeywell PCM45F-SP this material exhibits excellent wetting at interfaces during typical operating temperature range,
resulting in very low surface contact resistance. It is available in both pad and paste/printable formats.
A proprietary filler material provides high thermal conductivity (2.0–5.0 W/m˚C) and a low thermal impedance (<0.20˚C cm2/W),
suitable for high performance IC devices.
THERMAL IMPEDANCE POST RELIABILITY
(No shim @ 40psi) Honeywell PCM45F Honeywell PCM45F-SP
End of Line 0.12˚C-cm2/W 0.12˚C-cm2/W
1000 hrs T/C “B” 0.08˚C-cm2/W 0.08˚C-cm2/W
Baking 500 hrs 0.08˚C-cm2/W 0.08˚C-cm2/W @ 150˚C
