Laird Tflex360 Tflex 300
Thermal Gap Filler
Laird Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a
thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
Laird Tflex 300H is offered with a hard, metallized liner option for easy handling and improved
rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts
that must slide together, such as a card into a chassis.
Laird Tflex 300TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a
guaranteed dielectric barrier, and easier part handling for mass production.
FEATURES AND BENEFITS
• Extreme compliancy allows material to “totally blanket” components
• Thermal conductivity of 1.2 W/mK
• Low compression set enables the pad to be reused many times
• Environmentally friendly solution that meets regulatory requirements including RoHS and
REACH
