Features and benefits
Thermal conductivity: 10 W/m-K
Dispensable pre-cured gel
Stable viscosity in storage and in applications
Excellent chemical stability and mechanical stability
BERGQUIST LIQUI FORM TLF 10000 is a thermally conductive, one-part liquid formable gel material.
BERGQUIST LIQUI FORM TLF 10000 thermally conductive gel interface material is designed to meet the demanding requirements
in certain telecom and other demanding applications.
Its unique formulation assures a balanced mix of high thermal conductivity, excellent dispensing efficiency, and high thermal stability.
This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly
where a highly reliable vertical gap stability is required. It is most effective for gaps as narrow as ≤2.5mm.
BERGQUIST LIQUI FORM TLF 10000 is pre-cured, requiring no mixing or refrigeration.
Typical applications RRU/AAU/BBU in wireless in telecom wireless infrastructure Filling various gaps between heat-generating devices to
heat sink Devices requiring low assembly pressure High value assemblies where rework is required
